Pasting Paper

Glass fiber pasting paper that wraps plates to support wet paste in modern plate manufacturing.

0.05–0.40 mm @100 kPa180±10 g/m²·mmBET ≥2.0 m²/g
Datasheet

The numbers, in full

Printed catalogue values plus design targets. Compression and recovery behaviour from 10 to 100 kPa below — request the full TDS for customer-specific tolerances.

Technical data Glass fiber · process material
Thickness range @100 kPa 0.05–0.40mm
Density 180 ±10g/m²·mm
Avg. fiber diameter 0.5–1.5μm
Design values
Specific surface area (BET) ≥ 2.0m²/g
Avg. beating degree ≥ 39°SR
Good evenness for uniform paste application
Chemically stable in battery service
Good assembling performance on high-speed pasting lines
High tensile strength for high-speed pasting production
High BET for efficient paste adhesion

Verified by third-party SEM, ICP and BET analysis. RoHS & REACH compliant. Full TDS on request.

Compression · 10→100 kPa compression dry recovery wet recovery
0.179 mm 0.123 mm 0.20.150.10.05 0 10 40 70 100 kPa

Thickness (mm) vs test pressure. Approximate values read from printed catalogue curves — measured curves ship with the full TDS.

Function in the battery

What pasting paper does in plate manufacturing

Pasting paper is a thin, even, chemically stable glass fiber sheet applied to the plate surface during pasting. With the highest specific surface area in our range (BET ≥ 2.0 m²/g) and a tight 0.5–1.5 μm fiber blend, it holds lead paste uniformly through curing and assembly.

It is indispensable in modern lead-acid plate manufacturing — particularly for continuous grid pasting lines and applications requiring high reliability and durability.

01

Enhanced adhesion of active materials

Provides a porous, high-surface-area substrate for uniform application of lead paste (PbO₂ for positive plates, sponge lead for negative plates), ensuring strong adhesion between active material and grid and minimizing delamination during cycling.

02

Improved electrochemical efficiency

Capillary action facilitates efficient electrolyte penetration, enabling better ion exchange between the lead paste and sulfuric acid — optimizing reaction kinetics, prolonging battery life and reducing internal resistance.

03

Structural stability

Acting as a mechanical binder, pasting paper maintains electrode integrity during charge–discharge cycles and resists warping or cracking, especially in high-temperature or deep-discharge scenarios.

04

Optimized grid-to-paste interface

In continuous grid pasting technology, the paper ensures seamless contact between the lead grid and the pasted active material, minimizing interfacial resistance and improving current distribution uniformity.

Samples & TDS

Qualifying a second source?

Send us your spec. Samples and the full Pasting Paper TDS ship within days.